Measurement of internal strain in solder cross-sections using EBSD.
"What issues arise from differences in implementation conditions or aging deterioration?" We will examine the problems lurking within the solder.
The Electron Backscatter Diffraction Pattern (EBSD) method, when combined with a scanning electron microscope (SEM), enables the following: - Analysis of crystal grain size and phase structure in micro-regions - Evaluation of residual stress in small areas such as mounting parts (with analysis examples at approximately 50μm) This case introduces the measurement of internal strain in solder cross-sections using EBSD. Changes in "internal strain of solder due to thermal shock testing" were confirmed with EBSD. This measurement technique can be applied to predict potential defects arising from variations in solder conditions or aging degradation. We encourage you to give it a try. Additionally, our company conducts various cross-sectional analyses using TEM in conjunction with EBSD and SEM. We would be happy to assist you, so please feel free to reach out. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/ *We have many other materials available. If you request through the inquiry button, we will send them to you.
- Company：セイコーフューチャークリエーション
- Price：Other
